About Advanced Ceramics Introduction

Advanced Ceramics | Application of Structural Ceramics

Mainly used to make circuit substrates, coil bobbins, tube sockets, high-voltage insulating porcelain, rocket nose cones, etc. It can also be made into high porosity precision casting cores for casting alloys. It can also be used as a high temperature material with good shock resistance.

Advanced ceramics mainly refer to a large class of new ceramic materials that exert their mechanical, thermal, chemical and other properties. They can serve in many harsh working environments, and thus become the key to the realization of many emerging science and technology.

Optical Communication Industry
The optical communication industry is one of the fastest growing high-tech industries in the world, with a global output value of more than 3 billion US dollars. Its rapid development mainly depends on the research on the mechanism of optical fiber loss and the use of structural materials for optical fiber joints. Our institute has successfully used zirconia toughened ceramic materials to develop optical fiber connectors and sleeves, which have excellent performance and well meet the development needs of my country's optical communication industry.
With the high density and high power of semiconductor devices, the development of integrated circuit manufacturing industry urgently needs to develop a new type of substrate material with good insulation and fast heat conduction. The high thermal conductivity aluminum nitride and silicon carbide substrate materials that came out in the mid-to-late 1980s are gradually replacing the traditional alumina substrate. In this field, the thermal conductivity of the high thermal conductivity aluminum nitride ceramics developed by our institute has reached 228 W/m ×K, the performance ranks the forefront at home and abroad. Aluminum nitride-glass composite material has become a research hotspot in the field of contemporary electronic packaging materials. Its thermal conductivity is 5-10 times that of alumina-glass, and the sintering temperature is within 1000°C. It can be used with wiring materials such as silver and copper. Co-fired to produce multilayer wiring boards with good thermal conductivity and electrical properties. The aluminum nitride-glass composite material developed by me has a thermal conductivity of 10.8 W/m×K, which is in a leading position in the world. It meets the requirements of miniaturization and densification of large-scale integrated circuits.